Q/ZX
Shenzhen ZTE Corporation enterprise standard
(design)

Q/ZX 04.100.4-2001.Printed circuit board design specification
Basic requirements - device packaging library
The 2001-09-21 issued 2001-09-21 implementation of
Shenzhen ZTE Corporation hair cloth I

Q/ZX 04.100.4-2001.Eye time
Introduction...... Ⅲ
1 scope... 1
2 reference... 1
3 term... 1
4 the instructions... 1
Five pads naming method... ... 1
6 SMD components encapsulation library naming method... ... 3
6.1 SMD discrete element method named... ... 3
6.2 the naming of SMD IC method... ... 4
7 instrumentation components named method... 6
7.1 non-polarity axial pin component naming method... 6
7.2 with polar capacitors naming method... 6
7.3 non-polarity cylindrical element naming method... 6
7.4 diode naming method... 7
7.5 non-polarity offset shaped pin naming method of discrete component... ... 7
7.6 non-polarity radial pin component naming method... ... 8
7.7 TO class element named method... 8
7.8 adjustable potentiometer naming method... ... 8
7.9 instrumentation CLCC element naming method... ... 8
7.10 instrumentation DIP naming method... ... 8
7.11 PGA naming method... ... 9
7.12 relay named method... ... 9
7.13 single encapsulated component naming method... 9
7.14 the transformer naming method... ... 10
7.15 the power supply module named method... 10
7.16 crystal and vibration method named... ... 10
7.17 optical device naming method... ... 10
Eight of the connector named method... ... 10
8.1 rf coaxial connector named method... ... 10
8.2 DIN european-style socket naming method... ... 10 q/ZX 04.100.4-2001
8.3 2 mm series connector named method... 11.
8.4 naming method of IC packages... ... 11.
8.5 D - SUB socket naming method... 11.
8.6 flat cable connector named method... ... 12
8.7 telecommunication connector named method... ... 12
Screen printing of nine requirements... 12
10 graphics origin... 16
Annex A, informative appendices CADENCE symbol table drilling... 17
IIIII

Q/ZX 04.100.4-2001.Before the word
Q/ZX 04.100 "printed circuit board design code" is a series of standards, including the following parts:
Part 1 (Q/ZX 04.100.1) : document requirements;
Part 2 (Q/ZX 04.100.2) : manufacturability requirements;
Part 3 (Q/ZX 04.100.3) : production of testability requirements;
Part 4 (Q/ZX 04.100.4) : device packaging library basic requirements;
.
They never tongfang face printed circuit board design request,
Is part 4 of this standard, this standard specifies the ZTE Corporation in the design of printed circuit board solder life
Name, device packaging library naming, screen printing and origin of coordinates and other requirements,
This standard put forward by shenzhen ZTE Corporation kang company technology department, technology center department under centralized,
This standard drafting departments: kang company, such as the technology department
This standard drafters: jia, maike, Gu Zhong, chorin, PangJian, SuiShiJu,
On September first published in 2001, this standard - device packaging library basic requirements
Shenzhen ZTE Corporation enterprise standard
(design)
Printed circuit board design specification

Q/ZX 04.100.4-2001.Scope of 1
The provisions of this standard in the design of the printed circuit board (PCB) used in the welding plate, device packaging library life
Basic requirements such as name, screen printing, graphic origin of coordinates,
This standard applies to shenzhen ZTE Corporation PCB board design,
2 normative reference file
In the referenced file below, for the enterprise standard parts not write s number, should be to use online the most
The new standard for the valid version,
The IPC - SM - 782 Surface Mount Design and Land Pattern Standard,
Q/ZX 04.100.2 PCB design specifications, manufacturability requirements,
3 term
SMD: Surface Mount Devices/SMT components,
RA: Resistor Arrays/exclusion,
MELF: Metal electrode face components/Metal electrodes leadless face components.
SOT: Small outline transistor/Small transistor,
SOD: Small outline diode/Small appearance diode,
SOIC: Small outline Integrated Circuits/Small outline IC.
SSOIC: the Shrink Small Outline Integrated Circuits/narrow Integrated circuit.
SOP: Small Outline Package Integrated Circuits/Small Outline Package Integrated Circuits.
SSOP: the Shrink Small Outline Package Integrated Circuits/Shrink packaging IC.
TSOP: Thin Small Outline Package/Thin Small Outline Package.
TSSOP: Thin Shrink Small Outline Package/Thin Shrink packaging.
CFP: Ceramic Flat Packs/Ceramic Flat pack.
SOJ: Small outline Integrated Circuits with J Leads/Small outline IC "J" shaped pin.
PQFP: Plastic Quad Flat Pack/Plastic square Flat Pack,
SQFP: the Shrink Quad Flat Pack/narrow rectangular Flat Pack,
CQFP: Ceramic Quad Flat Pack/Ceramic square Flat Pack,
PLCC: Plastic leaded chip carriers/Plastic package has lead chip carrier,
LCC: Leadless ceramic chip carriers/Leadless ceramic chip carrier,
DIP: Dual - In - Line components/double row pin element,
PBGA: Plastic Ball Grid Array/Ball Grid Array device,
4 use
Dimension: refers to the element the biggest appearance size,
Body size: refer to the components encapsulation body size=width X length,
Unit size: English unit as mil, metric unit for mm,
Graphic number: the same graphics name, description of different content, but behind the name plus 1, - 2 suffix, called
Graphic number,
Shenzhen ZTE Corporation implementation 1 q/ZX 04.100.4 approved the 2001-10-01 2001-09-21-2001
Note: in the name of the standard does not include graphic number, if necessary, can be in the final to add graphics code name,
The representation of a decimal point: in the name "r" is used on behalf of the decimal point, for example: 1.0 to 1 r0,
5 welding plate method named
Naming method of bonding pad, see table 1
Table 1 solder method named
Welding plate type referred to as standard graphic named
Light knowledge don't naming methods: MARK + graphics (C) (mm) in diameter

MARK
Name, for example: MARK1r0,
Table surface mount named methods: SMD (Y) + width x length (x) (mm)
The welding plate
SMD
Name, for example: SMD0r90X0r70 SMD2r20X1r20,
Table surface mount named methods: SMDC + bonding pad diameter (C) (mm)
Circular weld
SMDC
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